Remarks: 1.THIS SYSTEM IS A FULLY AUTOMATIC SOLDER BALL PLACEMENT SYSTEM. 2.TO GET A VERY GOOD STABILITY. THE SYSTEM USING HORIZONTAL AND VERTICLE PLACEMENT METHOD. 3.TO ENSURE PLACEMENT ACCURACY. THE SYSTEM USING A VERY HIGHLY PRECISION FIXTURE FOR IC POSITIONING.
4.TO POSITIONING ANY DIFFERENT SIZES OF SOLDER BALL AND IC FIXTURE THERE IS NO LIMITATION OF ANY SIZE OF PACKAGE BODY AND BALL-COUNT FOR THE APPLICATION. IT IS FRIENDLY AND ALSO CONSIDER AD A "UNIVERSAL" SOLDER BALL PLACING SYSTEM.
